Mid-temp Solder paste 183℃ 200g SGS lead-free environmentally friendly solder paste Sn64Bi35Ag1, medium temperature melting point 183 ℃, is a high-quality SMT patch solder paste BGA silver-containing solder paste, the solder joints are uniform and round, the melting point temperature is accurate, the conductivity is good, and there are no bubbles. It is a midium melt solder.

For s9 / s9i eries

Wide range of applications, can be used for factory SMT patch (component patch welding), LED patch (LED light bar and light strip), and can also be used for maintenance welding, such as tinning of hash board ASIC chip, hash board heat dissipation Chip bonding, CPU main control chip tin plating, GPU particle tin plating, etc. 183°C is the melting point of solder paste, and it needs to be higher than 183°C when soldering.

Composition: Sn64Bi35Ag1

Melting point: 183℃

Particles: 25~45 microns

Weight: 200g

Features: lead-free environmental protection, easy to print

Solder paste usage requirements:

1. The solder paste should be kept in the refrigerator.

2. Before using the solder paste, take the solder paste out of the refrigerator in advance, and place it in the room to naturally return to temperature. This is to restore the solder paste to the normal indoor working temperature. Please note that the cap of the solder paste bottle should not be opened during the temperature recovery process to prevent moisture in the air from condensing on the surface of the solder paste and affecting the viscosity of the solder paste and the welding effect on the product. Solder paste is best used in an ambient temperature of 22°C-24°C and a humidity of 55-65%.

3. Before using the solder paste, in order to mix the flux and tin powder evenly, please stir it fully after returning to temperature, and stir until it can flow naturally.